Silicon-on-Insulator (SOI) Market Research Report: By Type (Fully Depleted Silicon on Insulator (FD-SOI), Partially Depleted Silicon on Insulator (PD-SOI), Power-SOI, Others), Wafer Size (Less than or equal to 200mm, 201mm and above), Technology (Bonding SOI, Layer Transfer SOI, Smart Cut), Application (MEMS, Power Supplies, Optical Communication, Image Sensing, Others), Vertical (Consumer Electronics, Automotive, IT & Telecommunication, Aerospace & Defense, Industrial, Others) and Region (North America, Europe, Asia-Pacific and Rest of the World) - Forecast till 2027
ID: MRFR/SEM/8657-HCR | February 2021 | Region: Global | 100 pages
Silicon-on-Insulator MarketSynopsis
Silicon-on-Insulator Market is estimated to reach USD 2,403.9 Million by 2026, registering a CAGR of 15.5% during the forecast period of 2020–2026.
Silicon-on-insulator (SOI) is a semiconductor component that comprises a thin layer of insulator inserted between single crystalline silicon and the bulk substrate. The insulator is generally made up of thermal silicon oxide (SiO2) and the substrate is asilicon wafer。根据应用程序的类型,硅片n film can be very thin (< 50 nm for fully depleted transistors), or it can be tens of micrometers thick. There are three methods used in fabricating SOI wafers -- Bonded & Etchback SOI (BESOI), Separation by IMplantation of OXygen (SIMOX), and SmartCut. These processes can produce substrates possessing different characteristics in final products. Increasing adoption of electronic devices by consumers is driving the adoption of SOI wafers. The SOI wafers provide superior performance and require minimal voltage for its operation. These factors are expected to drive the Silicon-on-Insulator Market across the globe. Moreover, increasing the adoption of SOI technology in IoT devices and applications is expected to create opportunities for wafer manufacturers to develop wafers using this technology. However, a lack of skilled workforce is expected to disrupt the manufacturing of these wafers and therefore, hamper the Silicon-on-Insulator Market growth during the forecast period.
Segmentation
Silicon-on-Insulator Market has been segmented based on Type, Wafer Size, Technology, Application, Vertical, and Region.
- By Type,绝缘体市场细分ed into fully depleted silicon on insulator (FD-SOI), partially depleted silicon on insulator (PD-SOI), power-SOI, and others.
- By Wafer Size, the Silicon-on-Insulator Market has been bifurcated into less than or equal to 200mm and 201mm and above.
- By Technology,绝缘体市场细分ed into bonding SOI, layer transfer SOI, and Smart Cut.
- By Application,绝缘体市场细分ed into MEMS, power supplies, optical communication, image sensing, and others.
- By Vertical,绝缘体市场细分ed into consumer electronics, automotive, IT & telecommunication, aerospace & defense, industrial, and others.
- By Region,绝缘体市场细分ed into North America, Europe, Asia-Pacific, and the rest of the world.
Silicon-on-Insulator (SOI) Market, 2018–2026 (USD Million)
Source: MRFR Analysis
Regional Analysis
Silicon-on-Insulator Market is estimated to grow at a significant rate during the forecast period from 2020 to 2026. The geographic analysis of Silicon-on-Insulator Market has been conducted for North America (the US, Canada, and Mexico), Europe (the UK, Germany, France, Spain, Italy, and the rest of Europe), Asia-Pacific (China, Japan, India, and the rest of Asia-Pacific), and the rest of the world (the Middle East and Africa and South America). Among these regions, the Asia-Pacific region has dominated the global Silicon-on-Insulator Market in 2019 and is expected to maintain its dominance throughout the forecast period. On the other hand, the North American region is expected to witness the fastest growth of Silicon-on-Insulator Market during the forecast period. Increasing research and developments of semiconductor components in this region has attributed to the growth of Silicon-on-Insulator Market in North American region over the forecast period.
Key Players
MRFR识别的关键球员in the Silicon-on-Insulator (SOI) Market. These Include EV Group (Austria), Evaderis (France), GlobalFoundries (US), GlobalWafers (Taiwan), Ineda Systems (India), MagnaChip Semiconductor (South Korea), Murata Manufacturing (Japan), NXP Semiconductors NV (The Netherlands), Qorvo (US), Qualcomm Technologies Inc. (US), Simgui (China), SOItec (France), STMicroelectronics NV (Switzerland), SUMCO (Japan), Shin-Etsu Chemical (Japan), Silicon Valley Microelectronics Inc. (US), Simgui (China), Skyworks Solutions (US), Sony Corporation (Japan), Taiwan Semiconductor Manufacturing Company (Taiwan), TowerJazz (Israel), Ultrasil LLC (US), United Microelectronics Corporation (Taiwan), and WaferPro (US). These players focus on innovation and thus, invest in research and development to present a cost-effective product portfolio. There have been recent mergers and acquisitions among the key players, a strategy the business entities leverage to strengthen their reach to the customers.
Industry News
- In March 2020, Toshiba has launched it's TaRFSOI (Toshiba RF-SOI) is SOI-CMOS (silicon on insulator complementary metal-oxide semiconductor), an original front-end process technology that Toshiba developed for RF switch ICs. This will improve the performance of mobile devices by improving its wireless frequencies.
- In February 2020, the researchers from Korea Advanced Institute of Science and Technology (KAIST), Korea Institute of Science and Technology (KIST), and Hanyang University have monolithically integrated indium gallium arsenide (InGaAs) photodiodes (PD) with silicon-on-insulator (SOI) metal-oxide-semiconductor field-effect transistors (MOSFETs).
- In May 2019, Arm Limited has collaborated with Samsung Foundry, Cadence, and Sondrel, to develop its first internet of things (IoT) test chip and development board. The test chip is a 28nm fully-depleted silicon-on-insulator (FD-SOI) embedded MagnetoResistive Random Access Memory (eMRAM), which is designed to offer more choice to IoT designers in system-on-chip (SoC) development.
Intended Audience
- Investors and Consultants
- Government Organizations
- Research/Consultancy Firms
- Manufacturers
- Safety Providers
- Industries
Report Scope:
| Report Attribute/Metric | Details |
|---|---|
| Market Size | USD 2,403.9 Million |
| CAGR | 15.5% |
| Base Year | 2019 |
| Forecast Period | 2020-2027 |
| Historical Data | 2018 |
| Forecast Units | Value (USD Million) |
| Report Coverage | Revenue Forecast, Competitive Landscape, Growth Factors, and Trends |
| Segments Covered | Type, Technology, Application and Region |
| Geographies Covered | North America, Europe, Asia-Pacific, and Rest of the World (RoW) |
| Key Vendors | Silicon-on-Insulator (SOI) Market. These Include EV Group (Austria), Evaderis (France), GlobalFoundries (US), GlobalWafers (Taiwan), Ineda Systems (India), MagnaChip Semiconductor (South Korea), Murata Manufacturing (Japan), NXP Semiconductors NV (The Netherlands), Qorvo (US), Qualcomm Technologies Inc. (US), Simgui (China), SOItec (France), STMicroelectronics NV (Switzerland), SUMCO (Japan), Shin-Etsu Chemical (Japan), Silicon Valley Microelectronics Inc. (US), Simgui (China), Skyworks Solutions (US), Sony Corporation (Japan), Taiwan Semiconductor Manufacturing Company (Taiwan), TowerJazz (Israel), Ultrasil LLC (US), United Microelectronics Corporation (Taiwan), and WaferPro (US). |
| Key Market Opportunities | Increasing the adoption of SOI technology in IoT devices and applications |
| Key Market Drivers | Increasing adoption of electronic devices by consumers |
Frequently Asked Questions (FAQ) :
The global silicon-on-insulator market is expected to reach a valuation of more than USD 2.4 billion by 2026.
The global silicon-on-insulator market is expected to exhibit a strong 15.5% CAGR over the forecast period from 2020 to 2026.
The growing IT and telecom industry is the major driver for the silicon-on-insulator market.
Asia Pacific dominates the global silicon-on-insulator market.
Leading players in the global silicon-on-insulator market include EV Group, MagnaChip Semiconductor, Qualcomm Technologies Inc., Qorvo, Evaderis, NXP Semiconductors NV, Shin-Etsu Chemical, and Simgui, among others.
Silicon-on-insulator (SOI) is a semiconductor component that comprises a thin layer of insulator inserted between single crystalline silicon and the bulk substrate. The insulator is generally made up of thermal silicon oxide (SiO2) and the substrate is a silicon wafer.