复合半导体市场研究报告：按产品类型（GaN，GaAs，SiC，INP，SiGe，Gap，Ins其他），由产品（光电子[LED，图像传感器，激光二极管，光耦合器和光伏电池]，RF器件[RF功率和RF开关]，电力电子（二极管，晶体管，电源模块和电源IC），通过应用（照明，电信，航空航天和国防，汽车，消费者显示等）和区域（北美，欧洲，亚太和世界其他地区） - 预测直到2027年

Compound Semiconductor MarketSynopsis

Compound Semiconductor Market is estimated to reach USD 4,465.2 Million by 2026, registering a CAGR of 6.53% during the forecast period of 2020–2026.

Semiconductors made of two or more elements are categorized as compound semiconductors. These semiconductors are most commonly made from combining elements from Group III and Group V of the Periodic Table. Although some are formed by combining the element of Groups II and Group VI or using elements of the same group. Earlier, owing to the high cost of manufacturing, compound semiconductors were not used in widespread commercial applications. However, over the past decade, rising investments in the development of electric vehicles, increasing government initiatives for adoption of 5G, and increasing demand for high-speed transceivers in the data center has propelled the demand for the compound semiconductor market.

Compound Semiconductor Market has been segmented based on by Type, By Product, By Application, and By Region.

通过类型，化合物半导体市场已被分段为氮化镓（GaN），砷化镓（GaAs），碳化硅（SiC），磷化铟（SiGe），硅锗（SiGe），砷化镓（间隙），抗疟原虫（INSB）和其他人。其他链段包括硒化镉（CdSe），碲化镉（CdTe），硒化锌（ZnSe），铝铟砷（Alinas），碲化镉（Cdznte）和汞镉碲化镉（MCT）。预计碳化硅（SiC）段预计将在预测期间主导化合物半导体市场。然而，由于在一般照明，标志和汽车领域的应用，氮化镓（GaN）段期望注册最高的CAGR。

By Product, the market has been segmented into Optoelectronics, RF devices, and power electronics. The optoelectronics segment is further sub-segmented into LED, image sensors, laser diode, optocouplers, and photovoltaic cells. The RF devices segment includes RF power and RF switching. The power electronics segment is further bifurcated into the diode, transistor, power modules, and power IC. The optoelectronics segment is expected to account for the largest market share. Furthermore, the LED sub-segment is expected to register the highest CAGR owing to the decrease in LED prices and the increase in the initiative by the government to promote the adoption of LED.

By Application, the compound semiconductor market has been segmented into lighting, telecommunication, aerospace & defense, automotive, consumer display, and others. The lighting segment is projected to hold the largest compound semiconductor market share. However, the telecommunication segment is expected to register a significant CAGR during the forecast period.

关键人物;主力;重要一员

全球化合物半导体市场研究报告中的关键员工是尼西亚公司（日本），三星电子（韩国），AMS AG（奥地利），Qorvo，Inc。（美国），SkyWorks Solutions，Inc。（美国），CreeInc.（美国），Gan Systems，Inc。一世n March 2020 GT Advanced Technologies entered into a 5-year agreement of USD 50 million with ON Semiconductor, wherein the former will produce and supply silicon carbide material to the latter.

Compound Semiconductor Market, 2018–2026 (USD Million)

Source: MRFR Website

Segmentation

基于类型，化合物半导体市场已被分段为GaN，GaAs，SiC，InP，SiGe，Gap，Insb等

Based on product, the market has been segmented into Optoelectronics [LED, Image Sensors, Laser Diode, Optocouplers, and Photovoltaic Cells], RF Devices [RF Power and RF Switching], Power Electronics (Diode, Transistor, Power Modules, and Power IC

基于申请，市场已被分段为照明，电信，航空航天和国防，汽车，消费者展示等

By region, the market has been segmented into North America, Europe, Asia-Pacific, and the rest of the world.

Regional Analysis

估计复合半导体市场以2020年至2026年的预测期内以大幅增长而增长。复合半导体的地理分析已为北美（美国，加拿大和墨西哥），欧洲（英国，德国，法国）进行了，意大利和欧洲其他地区），亚太地区（中国，日本，印度和亚太地区其他地区）以及世界其他地区（中东和非洲和南美洲）。

Based on region North America holds the largest share for the compound semiconductor market in 2019 and is expected to grow with significant growth during the forecast period. Various factors are leading to drive the growth of the compound semiconductor market in the North American region due to the presence of high-tech technology and developed infrastructure. Furthermore, the presence of companies such as Qorvo, Inc., Skyworks Solutions, Inc., and Cree Inc. in the region are also fueling in the growth of the compound semiconductor market. The rising demand for high-speed internet and the requirement for maintaining data traffic in two-way communication is also fueling the market growth in the region.

However, the Asia-Pacific region is expected to be the fastest-growing region for the compound semiconductor market during the forecast period due to the commercialization of 5G services in the major countries in the region. Furthermore, the region is witnessing growing demand for the growing demand for compound semiconductor devices from industry including telecommunication, automotive and aerospace, and defense.

Competitive Analysis

The key players have adopted new product development, mergers, and acquisition as a part of their growth strategy to further increase their share in the global compound semiconductor market. For instance, in December 2018, Qorvo launched a 28GHz GaN-based front-end module to cater to the demands from 5Gfixed wireless accessbase stations.

There has been a recent partnership, and collaboration among the key players, a strategy the business entities leverage to strengthen their reach to the customers. For instance,in September 2018, STMicroelectronics collaborated with

Leti to develop GaN-on-Silicon technology for power conversion high efficiency, high-power applications such as automotive onboard chargers for electric and hybrid vehicles, servers, and wireless charging.

目标听众

• Silicon wafers开发人员


• 一世ntegrated chip developers


• 政府时代ncies


• Research Institutes & Universities


• 一世C Manufacturers


• 一世C Suppliers


• Semiconductor Industry


• Manufacturing Companies


• 消费电子产品制造商/供应商

报告范围：

Report Attribute/Metric	Details
Market Size	4,465.2百万美元
CAGR	6.53%
Base Year	2019
预测期	2020-2027
Historical Data	2019
Forecast Units	Value (USD Million)
Report Coverage	Revenue Forecast, Competitive Landscape, Growth Factors, and Trends
Segments Covered	Type, Product, Application and Region
Geographies Covered	North America, Europe, Asia-Pacific, and Rest of the World (RoW)
主要供应商	Nichia Corporation (Japan), Samsung Electronics (South Korea), AMS AG (Austria), Qorvo, Inc. (US), Skyworks Solutions, Inc. (US), Cree Inc. (US), GaN Systems, Inc. (Canada), Infineon Technologies AG (Germany), Mitsubishi Electric Corporation (Japan), NXP Semiconductors NV (Netherlands), and ON Semiconductor (US).
Key Market Opportunities	商业化5G服务。
Key Market Drivers	崛起的电动汽车发展投资。 一世ncreasing government initiatives for adoption of 5G. 一世ncreasing demand for high-speed transceivers in the data center.

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